BME VIK - Elektronikai technológia

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Electronics Technology

A tantárgy neve magyarul / Name of the subject in Hungarian: Elektronikai technológia

Last updated: 2024. február 20.

Budapest University of Technology and Economics
Faculty of Electrical Engineering and Informatics

Electrical Engineering

BSc

Course ID	Semester	Assessment	Credit	Tantárgyfélév
VIETAB01	3	2/0/2/f	4

3. Course coordinator and department Dr. Krammer Olivér,

4. Instructors

Name:	Title:	Department:
Dr. Oliver Krammer	assoc. prof.	Dept. of Electronics Technology
Dr. Peter Gordon	assoc. prof.	Dept. of Electronics Technology
Dr. Tamás Hurtony	assoc. prof.	Dept. of Electronics Technology
Dr. Bálint Medgyes	assoc. prof.	Dept. of Electronics Technology
Dr. Richárd Berényi	assoc. prof.	Dept. of Electronics Technology

5. Required knowledge Materials in Electronics

6. Pre-requisites

Kötelező:

NEM ( TárgyTeljesítve("BMEVIETAB00") ) ÉS

(Kepzes("5N-A7") VAGY
Kepzes("5N-A7H") VAGY
Kepzes("5NAA7"))

A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

A kötelező előtanulmányi rend az adott szak honlapján és képzési programjában található.

7. Objectives, learning outcomes and obtained knowledge

The primary objective of the Electronics Technology course is to provide students with the fundamentals and theoretical and practical knowledge of the design of electronic circuits and systems, the verification of the design and the validation of the designed circuits and devices. The objective of the course is to provide an overview of the structure, design, manufacturing and assembly technology of electronic components and devices, circuit modules and electronic appliances, and trends in the development of the field.

The course covers the knowledge of electronics technology, microelectronics, circuit design, assembly technology and electronic device development that is necessary for all electrical engineers to have a basic understanding of integrated circuits, the design of electronic components and systems, and to interact with industry specialists and researchers in this field.

8. Synopsis

Topics of lectures:

1. Introduction - the purpose of the subject, topics. Classification of electronic components, substrates, assemblies, and brief description of electronic materials.

2. Design and construction of electronic devices, device development, technical specifications, basics of mechanical, thermal, EMC (electromagnetic compatibility) design; design for manufacturing.

3. Through-hole and surface-mounted component structures, properties, classification, storage methods, surface-mounted active components and integrated circuit packages, chip size packages and wafer-level package assembly.

4. Soldering components, creating soldered joints, manual soldering process and tools, wave soldering technology steps, reflow soldering technology steps, and the thermal profile of automated soldering technologies.

5. Semiconductor chips and module circuits attaching methods and packaging, semiconductor chips mechanical attachment by adhesive bonding and Au-Si eutectic soldering, semiconductor chips electrical connection techniques, wire bonding techniques, flip-chip technology.

6. Single-sided, double-sided, multilayer and special circuit board technologies; subtractive, additive and semi-additive patterning technologies; hole-plating techniques for multilayer, co-laminated boards; high-resolution micro vias boards; sequential layered boards.

7. Ceramic- and polymer-based thick-film technology, insulator-based integrated circuits, materials and steps of thick-film technology, properties and types of screens, tape printing, hybrid IC fabrication technology, shapes and value adjustment of layer resistances, low- and high-temperature co-fired ceramic substrates.

8. Materials for additive electronic manufacturing technologies: metal powders, ceramics, thermoplastic polymers, composites, and biochemicals. Technologies: photo-polymerisation, fused deposition modelling, direct metal deposition by electron beam, laser and plasma arc, direct metal deposition, beam material printing, selective laser melting and sintering, direct laser sintering of metals.

9. Vacuum technology, thin film technology, vacuum systems, vacuum pumps, vacuum evaporation and sputtering technology, direct and indirect electrically heated sources, electron beam heated evaporator sources, and thin-film integrated circuits.

10. Electronic quality assurance, the concept of quality, the basics of quality assurance techniques, in-line inspection equipment, qualification criteria for assembled circuits, and mechanical, thermal and electrical validation of electronic devices.

11. Reliability theory, causes and types of failure of electronic assemblies and devices, reliability functions, calculation of reliability characteristics. Analysis of failure modes, motivation, place and role of testing and failure analysis in electronics manufacturing and quality assurance.

12. Integrated circuit and device level thermal management, effects of heat and temperature changes on electronic assemblies and devices, heat energy transfer, thermal interfaces in electronic assemblies; heat sinks, direct and indirect liquid cooling, phase change cooling; thermal design fundamentals; thermal modelling fundamentals.

13. Invited industry speaker

14. Outlook lecture, Industry 4.0 in electronics manufacturing technologies, smart manufacturing, smart factory, industrial IoT (Internet of Things), basics of machine learning methods related to electronics manufacturing, machine-to-machine interfaces in electronics manufacturing; extended HMI (human-machine interface) tools for control and optimisation of machines on the shop floor.

Topics of lab practices:

1. Production of printed wiring boards using subtractive technology, drilling, drilling parameters, photolithography, tin electroplating, copper etching, and solder mask preparation.

2. Electronics circuit assembly by hand soldering; familiarisation with hand soldering tools, hand soldering of through-hole and large-size surface-mounted components (e.g. 1206 size code resistors) to printed wiring board, optical microscopy analysis of the completed joints.

3. Electronics circuit assembly using surface mount technology, reflow soldering, learning the steps of reflow soldering technology, manual stencil printing, inserting components using a manual insertion arm, creating joints in a reflow oven, and inspecting joints using an optical microscope.

4. Computer-aided design of experiments, systematic design of technological experiments, mapping of parameter spaces, determining relevant parameters, design of experiments, visualisation and evaluation of experimental results.

5. Design of printed wiring board, familiarisation with components of computer-aided design systems, creating schematic circuit diagram, design of component drawings, wiring of the circuit substrate, generating production files (Gerber).

6. Prototyping, 3D design basics of assembled circuits and enclosures, the structure of 3D design systems, design basics: creating sketches, creating 3D shapes from sketches, rotation, extrusion, logical operations with bodies, exporting designs - 3D file formats.

7. Thermal simulation of assembled and enclosed circuits; testing temperature distributions on a loaded high-power component; testing temperature distributions on a mounted module circuit as a function of design topology and load parameters.

9. Method of instruction Lectures and lab practices

10. Assessment

Period for lectures, seminars and practical work:

Participation in all 7 laboratory exercises and successful fulfillment. All laboratory exercises begin with a 15-minute test for checking successful preparation. A minimum of satisfactory level is expected. Two 60-minute mid-terms have to be fulfilled on a minimum of satisfactory level.

Examination period: no requirement.

11. Recaps

If failed, the 15-minute test can only be retaken with the complete laboratory exercise. No more than 2 laboratory exercises can be retaken during the semester.

Retaking the mid-terms for any reason (fail, intention to improve) is only possible one time. Re-retake is only allowed if the previous mid-terms are generally unsuccessful (less than one-third could pass).

12. Consultations Possible on request, prior to mid-terms.

13. References, textbooks and resources

Harsányi Gábor: Elektronikai technológia, BME Viking Zrt., VI202-010, Budapest, 2011

B. Illés, O. Krammer, A. Géczy: Reflow Soldering: Apparatus and Heat Transfer Processes, Elsevier, Amsterdam, Hollandia, 2020, ISBN: 9780128185056

Pinkola János (szerk.): Elektronikai Technológia Laboratórium, Műegyetemi kiadó, 55082, Budapest, 2007

14. Required learning hours and assignment

Lectures and lab practices	56
Preparation for lectures and lab practices	40
Preparation for mid-terms	24
Homework	-
Self-learning of lecture notes	-
Preparation for exams	-
Summary	120

15. Syllabus prepared by

Name:	Title:	Department:
Dr. Oliver Krammer	assoc. prof.	Dept. of Electronics Technology
Dr. Gábor Harsányi	prof.	Dept. of Electronics Technology
Dr. László Jakab	prof.	Dept. of Electronics Technology
Dr. Balázs Illés	prof.	Dept. of Electronics Technology
Dr. Attila Géczy	assoc. prof.	Dept. of Electronics Technology
Dr. Péter Gordon	assoc. prof.	Dept. of Electronics Technology
Dr. Tamás Hurtony	assoc. prof.	Dept. of Electronics Technology

IMSc program For the lab practices in the subject, students participating in the programme are placed in separate groups. For the students participating in the programme, some lab practices will be supervised by the most experienced colleague in the field (who is/has been doing research in the field), who will introduce the students to the current research topics and recent results in the field, in addition to the basic laboratory material.

IMSc score

IMSc scoring is based on the 2 extra tasks given in the summative assessment for the subject. The percentage of extra tasks in the summative assessment is 25%. Extra IMSc points can be obtained above a 75% pass mark in the summative assessments. The maximum IMSc score for the subject is 20 (max.

IMSc points are also available to students not participating in the programme.

Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics

Elektronikai technológia