Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics

Physics, microelectronics, electronics technology

The course aims to develop a detailed knowledge and critical understanding of Smart Systems technologies and the physics of MEMS devices. A significant range of principal and specialist skills will be developed in the fields of Smart Systems manufacturing technology, and its applications in MEMS and bio-MEMS devices. During the laboratory work, state-of-the-art smart systems are disassembled, discussed and analyzed.

Lecture topics:

1. Overview of smart systems, cyber-physical system, Internet-of-Things devices and concepts.
2. The concept and building blocks of integrated smart systems.
3. Cellphone as a smart system. Hierarchy of smartphones.
4. MEMS sensors and actuators inside a smart system.
5. Overview of smart system manufacturing technologies.
6. Manufacturing processes of integrated electronics and micro electro-mechanics (MEMS).
7. Packaging of integrated smart systems.
8. Micromechanics, electro-mechanical coupling
9. Analysis of typical electro-mechanical microsystems – micromirror, comb-drive, gyroscopes
10. Thermal microsystems, electro-thermal coupling
11. BioMEMS - fundamentals of microfluidics: laminar flow, mixing, flow focusing. Transport phenomenon: convective and conductive mass transfer, diffusion in microflows. Droplet microfluidics: fundamentals and applications. Flow map, typical multiphase flow regimes. Enhanced heat transfer in Taylor flow, mixing in microdroplets, compact modeling of two phase flows. Droplet manipulation, EWOD
12. Lab-on-a-Chip devices: Point-of-Care. LoC platforms and PoC concepts: case studies. Sample consumption, sample handling, throughput, sensitivity, specificity, resolution.
13. Physical methods - Sorting and counting techniques: hydrodinamic focusing, optical counting methods, scattering histogram plots, fluorescence activated cell sorting, impedance methods, Coulter counter
14. Biosensors in LoC devices: physical, electrochemical, electronic and optical methods. DNA manipulation techniques: data storage in DNA, Polymerase Chain Reaction (PCR) and Next Generation Sequencing (NGS)

Classroom/laboratory practice topics:

1. Inside the package - Testing and characterization of integrated electronics, sensors and MEMS (laboratory demonstration)
2. Cleanroom visit - Dicing, bonding and packaging of microsystems (laboratory demonstration)
3. Semiconductor technology at work (video documentary and discussions)
4. MEMS case-study - operation, simulation and characterization of a heatuator MEMS (computer laboratory demonstration)
5. Modeling of MEMS - compact modelling, reduced order modeling, multi-domain modeling (computer laboratory demonstration)
6. Fundamental effects in microfluidics (laboratory demonstration)

2 hours/week lectures and 1 hour/week (computer) laboratory practices including demonstration with practical examples and case studies.

a.         During the term: one mid-term test in the 9th week.

Requirement for granting the signature: >= 2 (satisfactory).

The signature is valid for the next semester, too.

b.         In the exam period:

Way of examination: written and oral.

On mid-term test. If a student fails to turn up at mid-term test, it can be repeated during the term. Failed mid-term test can only be repeated once. In principle there is no second repeat for the failed mid-term test.

By appointment with the instructors.

Mandatory curriculum:

-        Periodically updated electronic tutorials by the instructors

Optional, auxiliary resources

-        G. S. May, S. M. Sze: “Fundamentals of Semiconductor Fabrication”, Wiley, 2003. ISBN: 0-471-23279-3

-        J. S. Wilson: “Sensor Technology Handbook”, Elsevier-Newnes, 2005. ISBN: 0-7506-7729-5

-        D. K. Schröder: “Semiconductor Material and Device Characterization”, Wiley-Interscience, 2006. ISBN: 978-0-471-73906-7

-        S. M. Sze, Kwok K. Ng: “Physics of Semiconductor Devices”, Wiley-Interscience, 2007

-        M. Gad-el-Hak: “MEMS Design and Fabrication”, CRC Press, 2006. ISBN: 978-0-8493-9138-5

-        R. R. Tummala: “System on Package: Miniaturization of the Entire System”, McGraw-Hill, 2008. ISBN: 9780071459068

-        H. Geng: “Semiconductor Manufacturing Handbook”, McGraw-Hill, 2004.

-        J. A. Kubby: ”A Guide to Hands-on MEMS Design and Prototyping”, Cambridge University Press, 2011. ISBN 978-0-521-88925-4

-        Brand, Fedder, Hierold, Korvink, Tabata: “System-level Modeling of MEMS”, Wiley-VCH, 2013. ISBN 978-3-527-31903-9

-        H.-H. Lee: “Finite Element Simulations with ANSYS Workbench 15”, SDC Publications, 2014. ISBN: 978-1585039074

-        S. D. Senturia: “Microsystem Design”, Kluwer Academic Publishers, 2001. ISBN: 0-7923-7246-8

-        M. W. Collins, C. S. Konig: “Micro and Nano Flow Systems for Bioanalysis”, Springer New York, 2012.

-        D. Issadore, R. M. Westervelt: “Point-of-Care Diagnostics on a Chip”, Springer New York, 2013.

-        G. Evtugyn: “Biosensors: Essentials”, Springer New York, 2014.