Electronics Technology

A tantárgy neve magyarul / Name of the subject in Hungarian: Elektronikai technológia

Last updated: 2012. november 23.

Budapest University of Technology and Economics
Faculty of Electrical Engineering and Informatics
Course ID Semester Assessment Credit Tantárgyfélév
VIETA302   3/0/2/v 5  
3. Course coordinator and department Dr. Harsányi Gábor,
6. Pre-requisites
Kötelező:
(( Aláírás( ahol a TárgyKód = "BMETE11AX01", ahol a Ciklus = tetszőleges)
VAGY
Aláírás( ahol a TárgyKód = "BMETE11AX21", ahol a Ciklus = tetszőleges)
VAGY
Aláírás( ahol a TárgyKód = "BMETE111820", ahol a Ciklus = tetszőleges))

ÉS

(Aláírás( ahol a TárgyKód = "BMEGEMTAV01", ahol a Ciklus = tetszőleges)
VAGY
Aláírás( ahol a TárgyKód = "BMEGEMT1532", ahol a Ciklus = tetszőleges))

ÉS NEM (TargyEredmeny("BMEVIETAB00", "jegy", _) >= 2
VAGY
TárgyEredmény("BMEVIETAB00", "felvétel", AktualisFelev()) > 0) )

VAGY
EgyenCsoportTagja("Brazil 2015-16-1_erk")

ÉS Training.Code=("5N-A7")

A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

A kötelező előtanulmányi rend az adott szak honlapján és képzési programjában található.

7. Objectives, learning outcomes and obtained knowledge The primarily objective of the course is to provide the students with knowledge and practical skills related to circuit modules and systems. The course provides a comprehensive overview of microelectronic devices, components, mechatronic, optoelectronic and other modules and about the structure of electronic equipments including their manufacturing, maintenance and assembly technologies.

 

Obtained skills and expertise:

 

Students successfully completing the course are capable to elaborate the manufacturing methods, procedures and technologies of electronic devices. The acquired competences allow the students to design optimally the mass production of electronic components and devices, to install the production line and to take into consideration quality management and environment protection requirements.

 
8. Synopsis Lectures: Classification of electronic products and technologies; types forms, and assembling methods of electronic components; interconnection substrates of circuit modules, materials and technologies; printed wiring boards (PWBs), insulating substrate passive (thin- and thick-film) networks and high density interconnects; design methods and considerations; mounting and assembling methods of circuit modules; design and application of combined (optoelectronic and mechatronic) modules; basics of appliance design; quality, reliability, environment and other human oriented issues of electronics technology.

 

Laboratories: technology of double sided printed wiring boards with through-hole metallization; film deposition technologies of thick film circuits: screen-printing and firing. film deposition and patterning technologies of thin film networks: vacuum evaporation, photolithography and etching; laser processed applied in electronics technology; through-hole mounting of circuit modules; surface mounting of circuit modules.

 
13. References, textbooks and resources

BME-ETT: Virtual Laboratory Support for Packaging Education, 2000, http://www.ett.bme.hu/vlab

Thomas L. Landers, William D. Browne, Earnest W. Fant, Eric M. Malstrom, Neil Schmitt: Electronics Manufacturing Processes, Prentice Hall, 1994

14. Required learning hours and assignment
Kontakt óra
Félévközi készülés órákra
Felkészülés zárthelyire
Házi feladat elkészítése
Kijelölt írásos tananyag elsajátítása
Vizsgafelkészülés
Összesen